PRLog (Press Release)– Mar 09, 2011– Shuttle, an industry-leading designer and manufacturer of high-performance small form factor (SFF) PC bags for trash compactor solutions and creator of the XPC, today announced that the company will be showcasing its latest innovati garbage compactor review ons at CeBIT, Europe's largest trade fair for digital IT solutions held in Hannover, Germany from March 1-5, 2011.
At CeBIT in Germany, Shuttle will continue its success from the Consumer Electronics Show (CES) event held in North America last month with a hands-on European showcase of its latest new small form factor desktop solutions.
The highly-anticipated new 2011 line-up includes new 1-liter and 3-liter solutions, all-in-one PCs, as well as small form factor models featuring the latest 2nd Generation Int waste compactor el® Core™ i3, Core™ i5, and Core™ i7 "S garbage compactor andy Bridge" processors.
To set up a meeting with Shuttle at CeBIT, contact marketing@us.shuttle.com.
Shuttle at CeBIT 2011 Hanover Exhibition Centre Hall 17, Stand E41
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